这是描述信息
这是描述信息

Product Name:BGA solder ball

零售价
0.0
市场价
0.0
Pageviews:
1129
产品编号
所属分类:
BGA ball
English Name:
BGA solder ball
Retail Price:
0.00
Market Price:
0.00
数量
-
+
库存:
暂时无货
1
Product Description
[[[[[[产品参数, 参数]]]]]]

BGA solder ball suitable for BGA, MCM, CSP and other advanced IC packaging and sophisticated packaging and micro-welding applications.

BGA solder ball Common Specifications: 0.15,0.20,0.25,0.30,0.35,0.40,0.50,0.55,0.60,0.65,0.76 (Unit: mm) and the like. We can also provide help BGA solder paste.

 

img

扫二维码用手机看
未找到相应参数组,请于后台属性模板中添加
上一个
下一个

Guangdong Zhongshi Metals Co., Ltd All rights reserved
 粤ICP备2023074191号
Powered by www.300.cn
Site Admin

Guangdong Zhongshi Metals Co., Ltd

Phone:0769-85231818 FAX:0769-85231838
Address:No.2,North Industy No.1 Road,Songshan Lake High-tech Industry development Zone,Dongguna City
Dongguan Songshan Lake High-tech Industrial
Development Zone, the industrial north
Site:
http://www.zs-jt.cn