Immediately after the red rubber is a single component room temperature storage heat curing epoxy resin adhesive, its allowable low temperature curing, ultra high speed micro a small amount of coating is still can keep good stable curing shapes without drawing, glue, collapse, its "shear thinning" viscosity properties and low moisture absorption, very suitable for printing application interesting hole in SMT process. Suitable for SMT point glue machine of high-speed dispensing, stencil printing and dispensing, needle way. Recommend to glue temperature 30 ℃ - 35 ℃. This product is in compliance with the eu RoHS2.0 and REACH regulation.

Advantage: the glue point shape stability, excellent heat resistance, strong thrust, strong adhesion, can completely eliminate SMT appears in the process of production of red glue wire drawing, electronic components off because of my poor adhesion phenomenon.